Thermal Interface Materials Market Trends set to witness Explosive growth by 2030

The Global Thermal Interface Materials Market size is valued at USD 3.5 billion in 2023 & is estimated to grow at a CAGR of around 7.8% during the forecast period, i.e., 2024-30.

Sep 5, 2024 - 13:41

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Thermal Interface Materials Market Trends set to witness Explosive growth by 2030

Global Thermal Interface Materials Market Overview:

According to MarkNtel Advisors study the Global Thermal Interface Materials Market size is valued at USD 3.5 billion in 2023 & is estimated to grow at a CAGR of around 7.8% during the forecast period, i.e., 2024-30. The accelerated growth is largely driven by the huge demand for modern electronic equipment and the boom in the computer chips and semiconductors industry due to advancements in modern trends and technologies including smart devices, self-driving cars, electric vehicles, renewable energy especially solar energy, automation, 5G telecommunication, medical equipment and cloud computing. The growth in these industries will increase the demand for materials that can help efficiently dissipate the heat from electronic devices, ensuring their proper functioning.

Key Findings of the Study: Thermal Interface Materials market

Global Thermal Interface Materials Market Challenge:

Keeping up with Rapid Advancements in Technology – The miniaturization of devices due to rapid advancement in technology has pushed the pace for the need for innovation in TIMs. The reduction in the dimension of these electronic devices and chips as well as the increase in their computing power results in the faster heating up of these devices due to the presence of high-density energy in the electronic circuit. Such scenarios demand an increasingly urgent innovation in TIMs. Such scenarios make the development of the materials for making TIMs that ensure the appropriate functioning of the electronic devices as per their requirements difficult. The materials used in TIMs for joining two solid surfaces for heat transfer should be such that there should be the least possible resistance when dissipating heat from the source that is circuit to the heat sink.

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Scope of the Thermal Interface Materials Market Report Segmentation

-By Type

Adhesives & Greases- Market Size & Forecast 2019-2030, Thousand Tons
Tapes- Market Size & Forecast 2019-2030, Thousand Tons
Elastomeric Pads- Market Size & Forecast 2019-2030, Thousand Tons
Paste & Gel- Market Size & Forecast 2019-2030, Thousand Tons
Phase Change Materials- Market Size & Forecast 2019-2030, Thousand Tons
Advanced Materials- Market Size & Forecast 2019-2030, Thousand Tons
Others- Market Size & Forecast 2019-2030, Thousand Tons

-By Application

Computers- Market Size & Forecast 2019-2030, Thousand Tons
Telecom- Market Size & Forecast 2019-2030, Thousand Tons
Medical Devices- Market Size & Forecast 2019-2030, Thousand Tons
Consumer Durables- Market Size & Forecast 2019-2030, Thousand Tons
Automotive Electronics- Market Size & Forecast 2019-2030, Thousand Tons
Renewable Energy- Market Size & Forecast 2019-2030, Thousand Tons
Industrial Equipment- Market Size & Forecast 2019-2030, Thousand Tons
Others (LED lighting, etc.)- Market Size & Forecast 2019-2030, Thousand Tons

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Geographical analysis:

-By Region

North America
South America
Europe
Asia-Pacific
Middle East & Africa

Asia Pacific remains the dominant market for thermal interface materials and the primary reason for this is the region is a manufacturing hub, especially for consumer electronics. Additionally, the region will continue to be the dominant player over the forecasted period because it has a huge population, a growing middle class, increasing disposable income, and remains the manufacturing hub for the world. Large corporations are setting up manufacturing capabilities in the region due to the availability of skilled and cheap labor.

Global Thermal Interface Materials Industry Recent Development:

2024: Indium Corporation showcases metal thermal interface materials for burn-in and test at TestConX. It is a high-performance metal TIM solution with pure indium metal delivering 86W/mK. This pure Indium can be covered with a thin aluminum layer on the side facing the device under test to prevent indium from adhering to the surface.

Current Landscape of Thermal Interface Materials Market

The report delineates key market participants and thoroughly assesses their strategic approaches, trends, innovations, and manufacturing infrastructure, enabling a forecast of their market impact over the next five years. The meticulously researched data presented holds the potential to distinguish even nascent market entrants in the long term. Armed with pertinent data and actionable insights, our research report delivers a comprehensive overview of the market, empowering investors and stakeholders to establish a robust presence in the Thermal Interface Materials market. The research report profiles major players, including

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DuPont (Laird)
3M
Honeywell International Inc.
Momentive Performance Materials
Semikron Danfoss
Henkel Corporation
Parker Hannifin Corp.
Wacker Chemie AG
Dow
Wakefield Thermal, Inc.
Indium Corporation
Shin-Etsu Chemical Co., Ltd.
Panasonic Corporation
Fujipoly
Arctic Silver, Inc.
Others

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