Jedec tray standard pdf

Jedec tray standard pdf

Rating: 4.8 / 5 (9926 votes)

Downloads: 63424

CLICK HERE TO DOWNLOAD

.

.

.

.

.

.

.

.

.

.

new terms will be defined in the descriptions of this standard. committee ( s) : jc- 11, jc- 11. ( 6) when we need to make a new tray, 1, we 1, l 2, w shall 2, l 3 land use s in the recommended value eiaj which edr- 7602 is standard. 35mm) accommodate 90% of all standard components, such as bga, csp, qfp, tqfp, qfn, tsop and soic. the outline dimensions of all jedec matrix trays are 12. after then, the eia/ jedec proposed a design guideline for fbga packages of up to 1. quantity pockets per tray qfn tray. moved permanently. 5 meeting held in october, 1998. cs- 003- b apr 1993: committee( s) : jc- 11, jc- 11. tray reference symbol 3. jep95 registrations main page. all the full- size jedec trays used by intel® can withstand temperatures of at least 150° c, or you can also refer to the maximum rated temperature marked on each tray. standard - thin matrix tray for handling and shipping plcc packages. for assistance, send the component manufacturer datasheet to topline. eiaj standard for fbga trays ( jc- 11. joint ipc/ jedec standard for handling, packing, shipping, and use of moisture/ reflow sensitive surface- mount devices. trays are stacked and bound together to form standard packing configurations. 1 structure of tray reference symbols in this standard, the structure of tray reference symbols is defined as follows. jedec standard trays are strong, with minimum twist, to hold and protect its contents. trays are bakeable up to 150oc and can be reused without any cracking or defects to the tray for up to five 24- hour bake cycles. the guidelines include tube/ rail standardization, intermediate packing, date codes, jedec tray standard pdf tube labeling, intermediate container and shipping labels, and standardize tube quantities. the document has moved here. guidelines for packing and labeling of integrated circuits in unit container packing ( tubes, trays, and tape and reel) jep130c. * 3: please refer to an attached sheet about the indication label. note 1: jedec standard outline 136 x 315mm ( 322. design requirements - generic matrix tray for handling and shipping, includes addition of optional side- wall bar code feature. * 4: the packing materials except tray may differ slightly from the color and dimensions depend on. joint ipc/ jedec standard for handling, packing, shipping, and use of moisture/ reflow sensitive surface- mount devices: j- std- 033d : joint ipc/ jedec standard moisture/ reflow sensitivity classification for non- hermetic surface mount devices ( smds) j- std- 020f : preconditioning of nonhermetic surface mount devices prior to reliability testing jedec publication no. 5mm with end tabs) note 2: pdf standard tray color: black conductive or dissipative molding compound esd safe. cs- 001 metric tab magazine family cs- 002 thin matrix tray for handling and shipping of pqfp cs- 003 thin matrix tray for handling and shipping of plcc packages cs- 004 thin matrix tray for handling and shipping of fqfp/ mqfp. inquiries, comments, and suggestions relative to the content of this jedec standard or publication should be addressed to jedec at the address below, or callor www. qfn ic matrix trays conform to jedec standards. symbol of qfp tray symbol of qfp types symbol of reference symbol qfp outline dimensions 3. the tray is designed for components that have leads on pdf four sides ( qfp and tqfp packages) and require component lead isolation jedec tray standard pdf during shipping, handling, or processing. jedec- compliant industry standard trays are used for qfp, bga, and pga semiconductors. of tray circuit ” are proceded. registration or login required. note 3: up to five jedec trays may be stacked with empty tray on top as a cover. * 1: the size of the outer box may be changed depending on the quantity of inner boxes. this document establishes guidelines for integrated circuit unit container and the next level ( intermediate) container packing and labeling. qfp, lqfp, tqfp ic matrix trays conform to jedec standards. these heat- resistant trays are not only more rigid, but they endure baking at 125° c, which is the recommended temperature for dehydrating moisture- sensitive devices. ( 7) the dimension “ w3- w 2” and “ l4- l 3” were changed “ 0. quantity pockets per tray. published by © jedec solid state technology associationnorth 10th street, suite 240 south arlington, va 22201. 25 from ” - to 0. future revisions of this document will also include tray and reel guidelines. 4mm thickness tray. 89 ” by the review of tray design guide. qfp ( mqfp) tray. sll uses only standard jedec tray configurations. fbga matrix tray design for shipping and handling) to the eia/ jedec, but this proposal was rejected by a vote of 7 to 7 with 8 abstentions at the jc- 11. jedec matrix ic trays. package material information. these changes will be. low profile trays with thickness of 0. qfp, lqfp, tqfp tray jedec matrix ic trays qfp, lqfp, tqfp ic matrix trays conform to jedec standards qfp body size quantity pockets per tray matrix row- column jedec reference order topline part number qfp ( mqfp) tray 10 x 10mm 96 6 x 16 cs- 004aa qtray10mm- 6x16 14 x 14mm 84 6 x 14 cs- 004ab qtray14mm- 6x14 14 x 20mm 66 6 x 11 cs- 004ac. carrier standards ( cs) contents. variations aa- al. * 2: the space in the outer box will be filled with empty inner boxes, pdf or cushions, etc. 2 mm in thickness.